SK Hynix Announces $3.87 Billion Investment for Chip Packaging Facility in Indiana #

SK Hynix, one of the world’s largest memory chipmakers, has revealed plans to invest $3.87 billion in its first chip packaging facility in the United States. The project, based in West Lafayette, Indiana, aims to support the company’s next-generation AI chip products. The facility is set to commence operations in 2028 and will create over a thousand jobs. SK Hynix’s investment aligns with the goals of the Biden administration to bolster domestic chip production. The project will also include an R&D facility for chip development. This investment joins the list of semiconductor investments made in the US following the U.S. CHIPS and Science Act.